About to MEIS 2027
The 2027 International Conference on Materials Engineering, Integrated Circuits, and Smart Grids will be held in Wenzhou, with the theme of "Small Devices Leveraging the Power Grid": materials determine the upper limit of devices, and devices change the granularity of power grid control. The conference is aimed at teams in the fields of electrical materials, power semiconductors, integrated circuits, power distribution equipment, and new energy operations, discussing topics such as third-generation semiconductors and packaging, magnetic/insulation/contact materials, energy storage safety materials, power management chips, sensing and measurement SoCs, low-voltage electrical intelligence, substation flexible interconnection, microgrids, virtual power plants, and demand response. The agenda adopts blind testing of production lines, dissection of failed components, rapid evaluation of standard compliance, practical operation of microgrids in the park, night talks on compliance with Wenzhou's overseas business, and roadshows for young engineers, emphasizing mass production, replaceability, and operability. Wenzhou's private electrical industry chain is complete, market response is fast, and overseas channels are wide, making it suitable for low-cost verification and rapid iteration. The conference aims to break through the closed loop of "materials chips equipment electricity prices" and establish a smart grid product family and testing standards that are suitable for small and medium-sized manufacturing and massive distributed resources.
IMPORTANT DATES
2027-01-15-Submission Deadline
2027-01-22-Registration Deadline
2027-01-29-Conference Date
About a week after the submission-Notification Date
RECORD
All full paper submissions to the MEIS 2027 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of MEIS 2027 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
Paper template
Please refer to the paper template for layout
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Register
All attendees must register in advance to attend the meeting
Consulting service
Submit
Please submit the full text/abstract of the paper to us through the electronic submission system
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Call For Papers
Materials Engineering
Optoelectronic Materials
Deformation And Fracture Of Materials
Material Processing
Plastic Research
Electronic And Electrical Materials
Mechanical Materials
Aerospace Materials
Magnetic Materials
High-Performance Materials
Material Modeling
Integrated Circuit
Digital Integrated Circuit Design
Design Of Analog And Mixed Signal Circuits
High Frequency (Rf) And Microwave Circuit Design
Low Power Circuit Design
Reconfigurable And Adaptive Circuit Design
Semiconductor Process Technology
......
Indexing Service
Technical Sponsor
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (meis@meeting-client.com) if you are interested in it.
SCI Journal
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to meis@meeting-client.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.
Submission Portal
If you have any questions or need any help about the conference, please feel free to contact our conference experts on the right:
谢老师
TEL:185 8481 1301
QQ:1720644276
E-mail:meis@meeting-client.com
About Plagiarism Check
Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.